Polyurethane potting compound 8601+8973 Kisling 0.9kg+0.25kg
  • Polyurethane potting compound 8601+8973 Kisling 0.9kg+0.25kg

Polyurethane potting compound 8601+8973 Kisling 0.9kg+0.25kg

Pouring, low Tg, very soft, black polyurethane (PU) mass. Mixing ratio 100:20, thermal conductivity 0.3 W/mK, -80 / +130. Packaging: 0.9kg + 0.25kg set.
Quantity
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Description
Product Details
A two-component, soft polyurethane resin. A solvent-free system that does not contain halogenated flame retardants. Offers very good electrical insulation, excellent adhesive properties, and is suitable for use at sub-zero temperatures while maintaining flexibility. Mixing ratio of 100:20, thermal conductivity of 0.3 W/mK, -80 / +130 temperature range. Areas of application include encapsulating sensors, windings, printed circuit boards, and electronic components.
Description
Product Details
KI-8601-8973-1150

Data sheet

Brand
Kisling
Application
encapsulation
Application
potting
Industry
electronic
Industry
electrical engineering
Industry
automotive
Material
polyurethane resin
Color
black
Consistency (supplied form)
fluid mass
Operating temperature
-80°C / +130°C
Operating temperature max
high (100°C - 150°C)
Operating temperature min
very low (below -45°C)
Hardness
25-30 ShA
Flammability
UL94 HB
Packing
0.9 kg + 0.25 kg set
Weight
1.15 kg
Viscosity dynamic [mPas]
1 800 – 2 400
Density [g/cm3]
0.95 – 1.00
Mixing ratio
100:20
Thermal conductivity [W/mK]
0.3

Specific References

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