Polyurethane potting compound 8601+8973 Kisling 4.5kg+2.5kg
  • Polyurethane potting compound 8601+8973 Kisling 4.5kg+2.5kg

Polyurethane potting compound 8601+8973 Kisling 4.5kg+2.5kg

Flood polyurethane foam, with a low Tg, very soft, black. Mixing ratio 100:20, thermal conductivity of 0.3 W/mK, -80 / +130. Packaging: set of 4.5kg + 2.5kg.
Quantity
On request
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Description
Product Details
Two-component, soft polyurethane resin. Solvent-free system, does not contain halogenated flame retardants. Offers very good electrical insulation, excellent adhesive properties and is suitable for use in sub-zero temperatures while maintaining elasticity. Mixing ratio 100:20, thermal conductivity 0.3 W/mK, -80 / +130. Areas of application: potting of sensors, windings, printed circuit boards and electronic components.
Description
Product Details
KI-8601-8973-7000

Data sheet

Brand
Kisling
Application
encapsulation
Application
potting
Industry
electronic
Industry
electrical engineering
Industry
automotive
Material
polyurethane resin
Color
black
Consistency (supplied form)
fluid mass
Operating temperature
-80°C / +130°C
Operating temperature max
high (100°C - 150°C)
Operating temperature min
very low (below -45°C)
Hardness
25-30 ShA
Flammability
UL94 HB
Packing
4.5kg + 2.5kg set
Weight
7 kg
Viscosity dynamic [mPas]
2 800 – 2 400
Density [g/cm3]
0.95 – 1.00
Mixing ratio
100:20
Thermal conductivity [W/mK]
0.3

Specific References

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