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Polyurethane potting compound 8601+8973 Kisling 4.5kg+2.5kg
Flood polyurethane foam, with a low Tg, very soft, black. Mixing ratio 100:20, thermal conductivity of 0.3 W/mK, -80 / +130. Packaging: set of 4.5kg + 2.5kg.
Description
Product Details
Two-component, soft polyurethane resin. Solvent-free system, does not contain halogenated flame retardants. Offers very good electrical insulation, excellent adhesive properties and is suitable for use in sub-zero temperatures while maintaining elasticity. Mixing ratio 100:20, thermal conductivity 0.3 W/mK, -80 / +130. Areas of application: potting of sensors, windings, printed circuit boards and electronic components.
Description
Product Details
KI-8601-8973-7000
Data sheet
- Brand
- Kisling
- Application
- encapsulation
- Application
- potting
- Industry
- electronic
- Industry
- electrical engineering
- Industry
- automotive
- Material
- polyurethane resin
- Color
- black
- Consistency (supplied form)
- fluid mass
- Operating temperature
- -80°C / +130°C
- Operating temperature max
- high (100°C - 150°C)
- Operating temperature min
- very low (below -45°C)
- Hardness
- 25-30 ShA
- Flammability
- UL94 HB
- Packing
- 4.5kg + 2.5kg set
- Weight
- 7 kg
- Viscosity dynamic [mPas]
- 2 800 – 2 400
- Density [g/cm3]
- 0.95 – 1.00
- Mixing ratio
- 100:20
- Thermal conductivity [W/mK]
- 0.3
Specific References
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